s data transfer demands soar, PCIe Gen 6 pushes the boundary to 64 GT/s, ushering in a new era of ultra-high-speed interconnects—but not without testing challenges.

 

At Arcanum, we’re preparing our TDR-based test strategies to ensure signal integrity, impedance control, and loss mitigation are ready for next-gen PCB designs.

 

Whether you’re designing for AI servers, HPC, or enterprise storage systems, we’re exploring what it takes to test and validate PCB performance under PCIe Gen 6’s demanding requirements.

 

Curious how high-speed specs impact your design validation? Let’s exchange ideas on how to engineer better solutions—together.