Arcanum Advanced Heading to Suwon, Korea for ASPS 2025

In the fast-moving semiconductor world, “testing” is more than verification — it’s the bridge between engineering needs and innovation.

From August 27–29, Arcanum will join the Advanced Semiconductor Packaging Show (ASPS 2025), partnering with local Korean teams to present our core solutions: DK & DF, BitWise, and Fixtures.

This is our first time at ASPS, aiming to explore the market and understand the challenges Korean engineering teams face in testing, signal integrity, and design verification.

At Arcanum, we’re building a brand that understands technology, communicates clearly, and embraces trial and error. Through this international stage, we hope to bring our spirit from Taiwan to a wider semiconductor community.