IST Test (Interconnect Stress Test, IPC TM650 2.6.26)
Interconnect Stress Test (IST) (IPC-TM-650 Method 2.6.26)
The Interconnect Stress Test (IST) is a PCB reliability evaluation method compliant with IPC-TM-650 Method 2.6.26.
This test applies electrical current to heat the test coupon, creating controlled thermal cycling through repeated heating and cooling, enabling rapid validation of PCB reliability.
For example, a 1,000-cycle IST test can typically be completed within five days, providing a significant time advantage compared to conventional thermal cycling methods.
IST is a widely accepted and adopted test method in the PCB industry, and also supports delamination (DELAM) detection and failure location analysis, making it an effective tool for both qualification and root-cause investigation.
Arcanum Advanced IST Testing Services
Arcanum Advanced provides professional IST testing services tailored to customer-defined test conditions.
If an IST test coupon design is not currently available, customers may contact our technical or sales team for test coupon design support.
