D-Coupon Test ( IPC 2221B D-Coupon, IPC TM650 2.6.27)

D-Coupon Test (IPC-2221B D-Coupon Test, IPC-TM-650 Method 2.6.27)

The IPC-2221B D-Coupon test is a reflow-based evaluation method defined in IPC-TM-650 Method 2.6.27.
This test monitors resistance changes during the reflow process to determine whether copper plating cracks occur as a result of thermal stress.

The method requires recording resistance variations while the test coupon undergoes reflow temperature cycling, providing a direct indication of via integrity under reflow conditions.

The D-Coupon test can be applied for both survivability testing and reliability evaluation.
All test conditions follow standard reflow temperature profiles, with typical peak temperatures ranging from 245 °C to 260 °C.

This method is primarily used for rapid reliability assessment of microvias, and can also be applied to other via structures when required.