Thermal Dk & Df
During PCB manufacturing, boards are subjected to multiple temperature cycles, including lamination, reflow, and other thermal processes. These steps involve repeated exposure to high and low temperature conditions.
Such temperature variations can lead to changes in the electrical properties of the selected PCB materials, which may in turn impact overall system performance in later stages.
Therefore, these potential variations should be characterized and considered early in the design phase, allowing engineers to account for material behavior under real thermal conditions and reduce downstream performance risk.
