EDSFF (E1.S/E1.L)
E1.S / E1.L Gen 6 Design Challenges
Under the PCIe Gen 6 architecture, EDSFF designs face several critical challenges:
-
PAM4 high-speed signal integrity (SI)
-
Control of insertion loss, return loss, and crosstalk
-
Combined effects of connectors, cables, and PCB stack-up
-
Thermal impact and material stability
-
Correlation between measurement and simulation results
These challenges can no longer be addressed by traditional design experience alone.
They require precise measurement and rigorous engineering validation.
Arcanum Advanced’s Gen 6 Enablement Capabilities
We provide dedicated test and validation solutions tailored for
EDSFF E1.S / E1.L PCIe Gen 6 designs, including:
-
S-parameter, TDR, and eye diagram measurements
-
Delta-L and thermal material stability analysis
-
Connector and fixture de-embedding
-
Channel compliance and correlation validation
-
System-level high-speed channel evaluation
From materials and PCB stack-up to connectors and full channel behavior,
we help customers capture true electrical performance early in the design cycle.
